This thread is for discussing the lifecycle document "Metal-only and spare-cell ECO after tape-out: procedure".
How a fix is made after tape-out by changing only metal and via layers, rewiring spare cells or programmable fill already in the base layers. A metal-only ECO keeps the costly base masks and can use wafers held before metallisation, so it is the usual first choice for a late or first-silicon fix. This procedure sets out the steps, roles, records and approval levels, and how the flow differs across lifecycles.
Read the document: https://www.thesemiconhub.com/lifecycle/documents/procedures/eco-metal-only
Point out anything that is wrong, unclear or missing, and say which section you mean. Reviewers read this thread when they audit the document.