This thread is for discussing the lifecycle document "Last assembly build: gate review pack".
The review that closes the technology: final builds complete and shipped, materials run out, tools redeployed or disposed of, and process, quality, reliability and compliance records archived for the agreed period. For operations, supply, quality and records leads.
Read the document: https://www.thesemiconhub.com/lifecycle/package-tech/gates/pkt-last-build/document
Point out anything that is wrong, unclear or missing, and say which section you mean. Reviewers read this thread when they audit the document.