This thread is for discussing the lifecycle document "Technology End of Life: stage guide".
How the package technology is withdrawn: the discontinuance notice to customers, last-time-buy plans, final builds, the run-out of materials and substrates, tool redeployment and the archive of process, quality and reliability records. Written for business, obsolescence, quality, operations and supply staff.
Read the document: https://www.thesemiconhub.com/lifecycle/package-tech/pkt-end-of-life/document
Point out anything that is wrong, unclear or missing, and say which section you mean. Reviewers read this thread when they audit the document.