This thread is for discussing the lifecycle document "Sign-off & Tape-out: stage guide".
How an RF die is closed for manufacture and how measurement is prepared in parallel: final physical checks, the sign-off review, release of the database to the foundry, and the evaluation boards, fixtures, de-embedding standards, characterisation plan and RF test strategy that must be ready when wafers return. For tape-out leads, circuit designers, characterisation and test engineers and program managers.
Read the document: https://www.thesemiconhub.com/lifecycle/rf/rf-tapeout/document
Point out anything that is wrong, unclear or missing, and say which section you mean. Reviewers read this thread when they audit the document.