This thread is for discussing the lifecycle document "Tape-out: gate review pack".
The review at which the layout, signed off with radiation layout rules and end-of-life dose corners, is released to the foundry with the package assembly drawings, and the export classification of the released data is confirmed. For physical design, sign-off, package, export and program leads.
Read the document: https://www.thesemiconhub.com/lifecycle/space/gates/spc-tape-out/document
Point out anything that is wrong, unclear or missing, and say which section you mean. Reviewers read this thread when they audit the document.