This thread is for discussing the lifecycle document "Yield & Test Data Monitoring: stage guide".
How test data is watched as volume ramps: yield and bin trends, statistical bin limits and alarms, outlier screening, tester and hardware health, excursion response and feedback to design, the fab and assembly. For product, yield and test data engineers.
Read the document: https://www.thesemiconhub.com/lifecycle/test-program/tp-yield-monitoring/document
Point out anything that is wrong, unclear or missing, and say which section you mean. Reviewers read this thread when they audit the document.