This thread is for discussing the lifecycle document "DFM Rules & Fill: stage guide".
How the kit gains the design for manufacturability content that protects yield beyond the minimum design rules: recommended rules, lithography hotspot checks, critical area guidance and the fill decks that keep every layer within its density windows. It covers how that content is drawn from yield learning, coded, proved on real layouts including the foundation IP, and released at the DFM rules and fill released gate. It is for DFM, yield, OPC, lithography, physical verification and extraction engineers, and for the kit release team.
Read the document: https://www.thesemiconhub.com/lifecycle/pdk/pdk-dfm-fill/document
Point out anything that is wrong, unclear or missing, and say which section you mean. Reviewers read this thread when they audit the document.