This thread is for discussing the lifecycle document "Multi-Die Sign-off & Tape-out: stage guide".
How the whole assembly of dies, interposer or bridge and substrate is checked as one system before the dies and the interposer are released to manufacture. Written for physical implementation engineers, co-design engineers, sign-off analysts and the programme leads who approve the release.
Read the document: https://www.thesemiconhub.com/lifecycle/chiplet/chiplet-multi-die-signoff/document
Point out anything that is wrong, unclear or missing, and say which section you mean. Reviewers read this thread when they audit the document.