This thread is for discussing the lifecycle document "End of life: gate review pack".
This pack prepares the final gate of the SoC lifecycle, where the part is no longer made or sold and its design and test data are archived. It covers confirming that final orders have shipped, completing the archive, handing over the obligations that outlast the product and recording lessons for future chips. It is for product managers, supply chain, quality and the engineering leads responsible for archives.
Read the document: https://www.thesemiconhub.com/lifecycle/soc/gates/end-of-life/document
Point out anything that is wrong, unclear or missing, and say which section you mean. Reviewers read this thread when they audit the document.